Circuit Board Gbona Conductivity ati Heat Dissipation Design Processability ibeere

1. Ooru rii apẹrẹ, sisanra ati agbegbe ti apẹrẹ

Ni ibamu si awọn gbona oniru awọn ibeere ti awọn ti a beere ooru wọbia irinše yẹ ki o wa ni kikun kà, gbọdọ rii daju wipe awọn junction otutu ti awọn ooru-ti o npese irinše, PCB dada otutu lati pade ọja oniru awọn ibeere.

2. Ooru rii iṣagbesori dada roughness design

Fun awọn ibeere iṣakoso igbona ti awọn paati ina ti o ga, ifọwọ ooru ati awọn paati ti aibikita dada iṣagbesori yẹ ki o jẹ iṣeduro lati de 3.2µm tabi paapaa 1.6µm, ti pọ si agbegbe olubasọrọ ti dada irin, ṣiṣe ni kikun lilo imudara igbona giga giga. ti awọn abuda ohun elo irin, lati dinku awọn olubasọrọ gbona resistance.Ṣugbọn ni gbogbogbo, aibikita ko yẹ ki o ga ju.

3. Aṣayan ohun elo kikun

Lati dinku resistance igbona ti dada olubasọrọ ti oke ipadanu paati agbara giga ati ifọwọ ooru, idabobo ni wiwo ati awọn ohun elo eleto elekitiriki, awọn ohun elo imudara igbona ti o gbona pẹlu adaṣe igbona giga yẹ ki o yan, fun apẹẹrẹ, idabobo ati imunadoko gbona. awọn ohun elo bii beryllium oxide (tabi aluminiomu trioxide) dì seramiki, fiimu polyimide, iwe mica, awọn ohun elo kikun gẹgẹbi girisi silikoni ti o gbona, ẹya-ara kan vulcanized silikoni roba, meji-paati thermally conductive silikoni roba, thermally conductive silikoni roba pad.

4. Fifi sori dada olubasọrọ

Fifi sori lai idabobo: paati iṣagbesori dada → ooru rii dada → PCB, meji-Layer olubasọrọ dada.
Fifi sori idabobo: paati iṣagbesori dada → ooru rii dada iṣagbesori → idabobo Layer → PCB (tabi ikarahun ẹnjini), awọn ipele mẹta ti dada olubasọrọ.Layer idabobo ti a fi sori ẹrọ ni ipele wo, o yẹ ki o da lori ipilẹ iṣagbesori paati tabi awọn ibeere idabobo itanna dada PCB.

ga iyara gbe ati ibi ẹrọ


Akoko ifiweranṣẹ: Oṣu kejila-31-2021

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